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Interface Material/Pads
Hi-Flow? *
Aavid Thermalloy has added a phase change
pad to its line-up. These pads provide low
TO-3
2X ? 3.56
(0.140)
TO-220
TO-218
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
12.70
(0.500)
3.73 DIA
(0.147)
18.80
(0.740)
2.69 DIA
(0.160)
material flows to fill in surface irregularities
and maximize the heat conduction path.
41.91
(1.650)
19.05
(0.750)
14.30
(0.563)
21.84
(0.860)
16.76
(0.660)
ORDERING INFORMATION
2X ? 2.36
(0.093)
28.96
(1.140)
MATERIAL PROPERTIES
example 12 digit part 530101B _ 5150G
Ordering code
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used. To order
additional Hi-Flow? pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Reinforcement carrier
Thickness
Continuous use temp (°C)
Phase change temp(°C)
Dielectric breakdown voltage (Vac)
Dielectric constant (1000 Hz)
Polymide
0.127 (0.005)
150
55
5000
4.5
Ordering code
0
Description
No pads
Volume resistivity (Ohm-meter)
Thermal impedance vs. pressure
1012
7
8
One Hi-Flow? pad
Two Hi-Flow? pads
Pressure
TO-220 Thermal performance (oC/W)
10
1.15
25
1.14
50
1.12
200
1.1
* Hi-Flow? is a registered trademark of the Bergquist Company
Alignment Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
Figure A
30.48
(1.200)
13.21
(0.520)
Figure B
7.62
(0.300)
11.68
(0.460)
ORDERING INFORMATION
example
25.02
(0.985)
0.76
(0.030)
5.08 21.84
(0.200) (0.860)
17.02
(0.670)
20.07
(0.790)
0.76
(0.030)
21.84
(0.860)
(0.020)
Suffix
Thermalloy origin part 7022B–8223–CL03 G
A B C
Device Figure A = Model number
3.10
(0.122)
25.40
(1.000)
3.25
(0.128)
9.40
(0.370)
14.22
(0.560)
0.51
3.18
TYP THK (0.125)
5.08
(0.200)
8223-CL03G
8241-CL11G
TO-220
TO-218
B
A
B = Alignment pad
C = RoHS compliant
Typical installation
Shown with part number 8241-CL11
Recommended hole pattern for 8223-CL03G
Recommended hole pattern for 8241-CL11G
PLATED THRU HOLE PER
DEVICE MANUFACTURERS
RECOMMENDATION
2.54
(0.100)
2.95 DIA PLATED
(0.116) THRU HOLE
2.54
(0.100)
1.60 DIA PLATED
(0.063) THRU HOLE
TYP(3)
5.46
(0.215)
5.46
(0.215)
2.95 DIA PLATED
(0.116) THRU HOLE
TYP(2)
CL 1
CLIP ASSEMBLY
7.37
(0.290)
14.73
(0.580)
12.70
(0.500)
25.40
(1.000)
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
ASIA
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
www.aavidthermalloy.com
EUROPE
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
87
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